Silicon Nitride Wafer
- Brand Name
- 3X Ceramic Parts
- Material Type
- silicone nitride
- MOQ
- 5 pieces
- Specification
- customized
- Density
- >3.2g/cm3
- Max working temperature
- 1200℃
- Thermal Conductivity
- 15~20W/m.k
- Compressive Strength
- 2500Mpa
- Flexural Strength
- > 600 Mpa
Silicone Nitride Ceramic Wafer Material Description :
Silicon nitride ceramic material has high hardness, low density, wear resistance and high temperature resistance. The rolling body is made of silicon nitride ceramic, while the other components are paired with bearing steel to form friction pair, the friction coefficient is extremely low, and it is not easy to stick and glue with the cage.Therefore, it has been considered as the preferred material for manufacturing high-speed and precision bearings.
Silicone Nitride Ceramic Wafer Features are as follows:
1. High rigidity, high strength and high hardness.
2. Strong corrosion resistance, can be used in strong acid and strong alkali.
3. High temperature resistant, silicon nitride ceramic balls under 1000 ℃ environment can be normal use.
4. Non-magnetic and electrical insulation.
5. Low density (3.26g/cm3), about 60% lighter than steel ball, reducing wear and noise.
6. The low linear expansion coefficient (3.2 * 10-6/K), almost 1/4 of the bearing steel, can withstand the rapid change of temperature.
7. Self-lubricity, can solve the pollution caused by the lubrication medium and add inconvenience, can be used in vacuum and high temperature.
8. Drug resistance, high mechanical strength, low thermal conductivity.
Silicone Nitride Material Datasheet:
Material Datesheet | |||
Properties | Units | Silicone Nitride | |
Mechanical | Density | gm/cc | 3.2 |
Porosity | % | 0 | |
Flexural Strength | Mpa | 830 | |
Compressive Strength | Mpa | 2500 | |
Elastic Modulus | Gpa | 310 | |
Poisson's Ratio | / | 0.27 | |
Hardness | kg/mm2 | 1580 | |
Fracture Toughness KIC | Mpa *m 1/2 | 6.1 | |
Thermal | Heat Conductivity | W/ m*k | 30 |
Coefficient of Thermal Expansion | 10-6/K | 3.3 | |
Specific Heat | j/kg*K | / | |
Thermal Shock Resistance | °C | / | |
Max UseTemperature | °C | 1400 | |
Electrical | Dielectric Strength | ac-kv/mm | / |
Dielectric Constant | / | 8 | |
Loss Tangent | / | / | |
Volume Resistivity | ohm•cm | >1014 |